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ITW Polymers Sealants North America INC STA'-PUT Z100® Solvent-Free Postformable Adhesive (formerly S162, C357, T357) / sta-put-z100-solvent-free-postformable-adhesive-formerly-s162-c357-t357

STA'-PUT Z100 Solvent-Free Postformable Adhesive is a patent-pending high-strength contact adhesive that bonds high-pressure laminate (HPL), particle board, MDF and a wide variety of other substrates. Z100 provides excellent initial grab with ultimate bond strength equarl to or greater than most solvent-based contact adhesives. Exceptional heat resistance and aggressive strength make Z100 ideal for postforming operations. Z100 contains zero flammability, zero VOCs, zero methylene chloride and zero HAPs. Z100 saves on costs by providing coverage 3-4 times greater than solvent-based adhesives. Z100's latex emulsion formulation provides an easy-to-use product with dry times that do not inconvenience operations. Z100 comes in bulk liquid pails and drums for spray or brush on application, as well as a convenient self-contained canister system.

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