Welcome! Ecomedes is the way to find the right product for you and the envionment. Learn about products' contributions to standards such as LEED and WELL by clicking Document Contributions.

ITW Polymers Sealants North America INC STA'-PUT Z100® Solvent-Free Postformable Adhesive (formerly S162, C357, T357) / sta-put-z100-solvent-free-postformable-adhesive-formerly-s162-c357-t357

STA'-PUT Z100 Solvent-Free Postformable Adhesive is a patent-pending high-strength contact adhesive that bonds high-pressure laminate (HPL), particle board, MDF and a wide variety of other substrates. Z100 provides excellent initial grab with ultimate bond strength equarl to or greater than most solvent-based contact adhesives. Exceptional heat resistance and aggressive strength make Z100 ideal for postforming operations. Z100 contains zero flammability, zero VOCs, zero methylene chloride and zero HAPs. Z100 saves on costs by providing coverage 3-4 times greater than solvent-based adhesives. Z100's latex emulsion formulation provides an easy-to-use product with dry times that do not inconvenience operations. Z100 comes in bulk liquid pails and drums for spray or brush on application, as well as a convenient self-contained canister system.

The information contained in this site was provided by the producer and/or certifier and we endeavor to keep the information up to date and correct. ecomedes make no representations or warranties of any kind, express or implied, about the completeness or availability of the product information on the site for any purpose. We encourage users to contact the producer or certifier directly for additional details. It’s important to note that no products individually or collectively, can guarantee a specific number of points for LEED, WELL, GreenGlobes or LBC certifications.

What's next? Add this product to a project and produce LEED documentation, WELL or if a product meets Federal Guidelines.